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Memory '26: HBM Inspection, Packaging & Bonding

8 tickers · $126.41B total market cap

Group: Memory

The AI-driven surge in demand for advanced packaging, particularly HBM and 2.5D/3D solutions, is creating a robust growth cycle for inspection, packaging, and bonding equipment and services. The structural shift towards higher-density, more complex AI architectures provides a compelling long-term tailwind, making the bull case more persuasive given current demand signals and technological transitions.

Memory '26: HBM Inspection, Packaging & Bonding tracks 8 publicly listed stocks in this theme: 0552.HK, AMKR, ASX, BESI.AS, CAMT, COTN.SW, KLIC, ONTO. See the constituent table for details.

Thesis update: 2026-03-04

Constituents

Build 20260415T080833

CompanyPrevious Quarter Report DateNext Expected Report DateLast Quarter Earnings Move %Earnings Move %Intra-Quarter Move %Since Last Report %Market capWeight
ASE Technology Holding Co., Ltd.ASX
02/05/2026 (BMO)04/29/2026 (BMO)10.01%28.65%$58.77B12.5000
BE Semiconductor Industries N.V.BESI.AS
02/19/2026 (BMO)04/23/2026 (BMO)-1.35%17.95%$20.25B12.5000
Amkor Technology, Inc.AMKR
02/09/2026 (AMC)04/27/2026 (AMC)6.95%9.17%$15.16B12.5000
Onto Innovation Inc.ONTO
02/19/2026 (AMC)05/07/2026 (AMC)-3.96%20.81%$13.00B12.5000
Camtek Ltd.CAMT
02/18/2026 (BMO)05/19/2026 (BMO)-2.43%17.98%$8.28B12.5000
Kulicke and Soffa Industries, Inc.KLIC
02/04/2026 (AMC)05/06/2026 (AMC)27.39%12.66%$4.18B12.5000
China Communications Services Corporation Limited0552.HK
03/31/2026 (BMO)-1.22%4.77%$3.75B12.5000
Comet Holding AGCOTN.SW
03/06/2026 (AMC)-0.42%26.58%$3.01B12.5000
Average4.37%17.32%$15.80B12.5000
Median-0.82%17.97%$10.64B12.5000
Std Dev9.82%7.69%$17.23B0.0%
Min-3.96%4.77%$3.01B12.5000
Max27.39%28.65%$58.77B12.5000
% Positive Tickers37.50%100.00%

* Provisional value: before LstRpt% reaches its 2-day post-report lock window (BMO/AMC adjusted), EarningsPerf is calculated from current vs pre-report and then locks to final LstRpt%.

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